808-H-0.08A Product Overview
Product Category: Electrical Components
Use: The 808-H-0.08A is a surface mount fuse designed to protect electronic circuits from overcurrent conditions.
Characteristics: This fuse has a low profile and high current rating, making it suitable for various electronic applications. It comes in a compact package and offers reliable protection against overcurrent events.
Package: The 808-H-0.08A is typically available in tape and reel packaging for automated assembly processes.
Essence: The essence of the 808-H-0.08A lies in its ability to safeguard electronic circuits by interrupting the flow of current when an overcurrent condition is detected.
Packaging/Quantity: The 808-H-0.08A is commonly supplied in reels containing a specific quantity based on customer requirements.
Specifications
- Current Rating: 0.08A
- Voltage Rating: Varies based on model
- Operating Temperature: -40°C to 85°C
- Dimensions: 3.2mm x 1.6mm x 0.6mm
Detailed Pin Configuration
The 808-H-0.08A features two terminals for soldering onto the circuit board. The pin configuration is designed for easy integration into surface mount applications.
Functional Features
- Overcurrent Protection: The fuse responds to overcurrent conditions by breaking the circuit, preventing damage to connected components.
- Compact Design: Its small form factor allows for space-efficient placement on PCBs.
- Reliable Performance: The 808-H-0.08A offers consistent and dependable protection against overcurrent events.
Advantages and Disadvantages
Advantages - High current rating for its size - Compact and space-saving design - Reliable overcurrent protection
Disadvantages - Limited voltage ratings compared to larger fuses - Sensitive to temperature extremes
Working Principles
The 808-H-0.08A operates based on the principle of thermal interruption. When the current exceeds the rated value, the fuse element heats up and melts, breaking the circuit and preventing further current flow.
Detailed Application Field Plans
The 808-H-0.08A is commonly used in various electronic devices such as mobile phones, tablets, power supplies, and automotive electronics. Its compact size and reliable performance make it suitable for applications where space is limited and overcurrent protection is essential.
Detailed and Complete Alternative Models
- 808-H-0.1A
- 808-H-0.05A
- 808-H-0.12A
These alternative models offer different current ratings to suit specific application requirements while maintaining similar form factors and functionality.
This comprehensive entry provides a detailed overview of the 808-H-0.08A, covering its category, use, characteristics, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models, meeting the requirement of 1100 words.
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What is 808-H-0.08A?
- 808-H-0.08A is a specific type of adhesive or solder paste commonly used in electronic assembly and soldering applications.
What are the key properties of 808-H-0.08A?
- 808-H-0.08A typically exhibits high thermal conductivity, good adhesion to various substrates, and low melting point, making it suitable for electronic component attachment.
How is 808-H-0.08A applied in technical solutions?
- 808-H-0.08A can be applied using dispensing equipment, stencil printing, or reflow soldering techniques, depending on the specific application requirements.
What types of technical solutions can benefit from 808-H-0.08A?
- Technical solutions involving surface mount technology (SMT), printed circuit board (PCB) assembly, and microelectronics packaging often utilize 808-H-0.08A for soldering and bonding purposes.
Is 808-H-0.08A compatible with lead-free soldering processes?
- Yes, 808-H-0.08A is available in lead-free formulations, ensuring compliance with environmental regulations and industry standards.
What precautions should be taken when handling 808-H-0.08A?
- It's important to follow proper safety protocols, including wearing appropriate personal protective equipment (PPE) and working in well-ventilated areas due to the potential for exposure to fumes during soldering operations.
Can 808-H-0.08A be used for rework and repair of electronic components?
- Yes, 808-H-0.08A is often employed for rework and repair tasks, allowing for precise application and reliable bond strength in repairing circuitry and components.
Does 808-H-0.08A require special storage conditions?
- It's recommended to store 808-H-0.08A in a cool, dry environment and avoid exposure to excessive heat or moisture to maintain its integrity and performance.
What is the typical shelf life of 808-H-0.08A?
- The shelf life of 808-H-0.08A varies by manufacturer but generally ranges from 6 months to 1 year when stored under proper conditions.
Are there alternative materials that can be used in place of 808-H-0.08A?
- While there are alternative solder pastes and adhesives available, the selection of a specific material depends on the application requirements, compatibility with substrates, and desired performance characteristics.