EP2SGX30CF780C5N

Product Overview

• Category: Field Programmable Gate Array (FPGA)
• Use: Digital logic circuits and systems
• Characteristics: High-performance, reconfigurable, programmable
• Package: Ceramic Ball Grid Array (CBGA)
• Essence: Integrated circuit for customizable digital logic implementation
• Packaging/Quantity: Single unit

Specifications

• Model: EP2SGX30CF780C5N
• Manufacturer: Intel Corporation
• Technology: 65nm
• Logic Elements: 29,040
• Embedded Memory: 1,518 Kbits
• Maximum User I/Os: 622
• Operating Voltage: 1.2V
• Operating Temperature: -40°C to 100°C
• Package Dimensions: 31mm x 31mm
• Package Type: CBGA
• Pin Count: 780

Detailed Pin Configuration

The EP2SGX30CF780C5N FPGA has a total of 780 pins, each serving a specific purpose in the circuit design. The pin configuration includes input/output pins, power supply pins, ground pins, and configuration pins. A detailed pinout diagram can be found in the product datasheet.

Functional Features

• High-performance computing capabilities
• Reconfigurable architecture for flexibility
• Support for various communication protocols
• On-chip memory for data storage
• Built-in DSP blocks for signal processing
• Low power consumption
• High-speed serial transceivers for high-speed data transfer

Advantages and Disadvantages

Advantages: - Flexibility and adaptability due to reconfigurability - High-performance computing capabilities - Support for various communication protocols - Low power consumption compared to traditional ASICs - Faster time-to-market for custom logic designs

Disadvantages: - Higher cost compared to fixed-function ASICs - Limited resources and capacity compared to larger FPGAs - Longer development time for complex designs

Working Principles

The EP2SGX30CF780C5N FPGA works based on the principle of reconfigurable logic. It consists of a matrix of configurable logic blocks (CLBs) interconnected through programmable routing channels. The configuration of CLBs and interconnections is determined by loading a bitstream into the FPGA, which defines the desired digital logic functionality.

During operation, the FPGA can be dynamically reprogrammed to implement different logic functions or adapt to changing requirements. This flexibility allows for rapid prototyping, system testing, and customization of digital circuits without the need for physical redesign.

Detailed Application Field Plans

The EP2SGX30CF780C5N FPGA finds applications in various fields, including:

1. Communications: Used in wireless base stations, network routers, and switches for high-speed data processing and protocol handling.
2. Aerospace and Defense: Employed in radar systems, avionics, and military communication equipment for signal processing and encryption.
3. Industrial Automation: Utilized in control systems, robotics, and factory automation for real-time data processing and control algorithms.
4. Medical Devices: Integrated into medical imaging systems, patient monitoring devices, and diagnostic equipment for image processing and data analysis.
5. Automotive: Applied in advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs) for sensor fusion and real-time control.

Detailed and Complete Alternative Models

1. EP2SGX30CF780I5N: Similar to EP2SGX30CF780C5N but with extended temperature range (-40°C to 125°C).
2. EP2SGX30CF780C6N: Upgraded version with higher logic elements and embedded memory capacity.
3. EP2SGX50CF780C5N: Larger FPGA with increased logic elements and I/O count for more complex designs.
4. EP2SGX15CF780C5N: Smaller FPGA with reduced logic elements and I/O count for cost-sensitive applications.

These alternative models provide options with varying capabilities and price points to suit different project requirements.

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